ZHENGZHOU SHINE ABRASIVES CO.,LTD
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Resin Bond Diamond Wheels 12V9 For Tungsten Carbide Tipped Saws
Shine Abrasives Resin Bond Diamond Wheels 12V9 Dish Shape For TCT Tipped Saws Face Grinding.
Face Grinding for Router Bits, Endmill face Grinding
The drawing of Shine Abrasives Resin Bond Diamond Wheels 12V9
For Tungsten Carbide Tipped Saws Face Grinding
Specifications of Shine Abrasives Resin Bond Diamond Wheels 12V9
For Tungsten Carbide Tipped Saws Face Grinding
| Abrasive Material:Diamond | Bond Type:Resin |
| Diamond Depth:3mm | Diamond Grit:120 grit, |
| Concentration:125% | Wheel Diameter: 5 inch 125mm |
| Wheel Thickness:25mm | Wheel Bore: 1-1/4 inch/31.75mm |
| Wheel Type:12V9 Dish Shape | Wheel Weight:0.6kgs/PC |
Question:
What's the application of Resin Bond Diamond wheel?
Resin bond diamond grinding wheel have advantages at high hardness, high strength and
strong grinding ability. It is mainly used for grinding high and hard alloys tools, non-metallic materials ,
also for cutting hard and brittle hard alloys tools, for grinding non-metallic minerals. likeTungsten Carbide,,
agate, optical glass, ceramics,semiconductor materials and wear-resistant cast iron, stone, etc.
Application picture for reference.